Invento i8320

Invento i8320

Per Node Specifications
  • 20 Nos. High Performance Dual Port Blade Servers in a 8U High blade enclosure
  • Liquid cooling support
  • PCIe Gen. 4 ready for SSD and Network IO
  • InfiniBand 200G HDR support
  • Security enhancement from booting to management
  • Front Access Design - front-loading nodes, HDD/SSD hot-swap and management
  • 8 x Redundant 2200W Titanium level Power Supply
  • Key Applications: Cloud Computing, Scientific Research, Virtualization, High-performance Computing (HPC)

Specification

Model i8320
Processor (per Node)
  • CPU:
    • Dual Socket P+ (LGA-4189)
    • 3rd Gen Intel® Xeon® Scalable Processors, 4 UPI up to 11.2 GT/s
    • TDP up to 220W
    • CPU TDP up to 270W with optional liquid cooling kit
System Memory (per Node)
  • Memory Capacity:
    • 16 DIMM slots
    • Up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
    • Supports Intel® Optane™ Persistent Memory
  • Memory Type Supported:
    • 3200/2933/2666/2400MHz ECC DDR4 RDIMM/LRDIMM
On-Board Devices (per Node)
  • Chipset: Intel® C621A chipset
  • Network Controllers:
    • 1x 200G Mellanox IB HDR,
    • 2x 25G Marvell onboard ethernet
  • IPMI: Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module
  • Graphics: ASPEED AST2600
Drive Bays (per Node)
  • Hot-swap
    • 2 Hot-Plug 2.5" NVMe/SATA3 drive bays
    • 1 Hot-Plug 2.5" SATA3 drive bay
  • M.2: 1 NVMe M.2
Input / Output (per Node)
  • TPM: 1 TPM Header
  • KVM: 1 Front Connector for KVM Card
Dimensions
  • Height: 14"
  • Width: 17.6"
  • Depth: 32"
System Cooling Fans: 3 optional fan trays or liquid cooling support with TDP up to 270W
Power Supply 8 Nos. x Redundant 2200W Titanium level Power Supply (96% Efficiency)